Products
INNOSHINE Semiconductor Product Roadmap
Available Products
Products in Development
Planned Products
Available Products
Premium Series
Flagship Technology
Value-for-Money Series
High Cost-Performance
Multiple Redundant Components
P0.9、P1.2、P1.5
Double Signal
Dual Power Backup
Triple Power Backup
Electromagnetic Compatibility Components
P0.9、P1.2、P1.5
Full Unit Passed EMC Class B
600*337.5 Quick-Mount Components
P0.9、P1.2、P1.5
Rental Quick-Mount Units
5G High-Speed Signal Transmission (Under Development)
P0.7、P0.9、P1.2、P1.5
5G Signal Transmission
High-Speed Transmission Inter
Products in Development
Premium Series(MOG)
Flagship Technology
Value-for-Money Series
High Cost-Performance
Multiple Redundant Components
P0.9、P1.2、P1.5
Double Signal
Dual Power Backup
Triple Power Backup
Electromagnetic Compatibility Components
P0.9、P1.2、P1.5
Full Unit Passed EMC Class B
600*337.5 Quick-Mount
P0.9、P1.2、P1.5
Rental Quick-Mount Units
5G High-Speed Signal Transmission(Under Development)
P0.7、P0.9、P1.2、P1.5
5G Signal Transmission
High-Speed Transmission Inter
Technology R&D Plan
Material R&D
Dual-Layer Multi-Dimensional Film Lamination
Improve Production Efficiency and Yield
High Transparency
Consistent Ink Color
IC R&D
Multi-Channel Integrated IC
Row and Column Integration
Energy Saving
Cold Screen
Display Chip R&D
MOG Integrated Display Chip
MOG 0202