Smart Manufacturing-元旭半导体科技股份有限公司

Smart Manufacturing

China's New Hub for Micro-LED Smart Manufacturing

Super Factory

The Super Smart Manufacturing Factory in Tianjin serves as the core engine for INNOSHINE Semiconductor to achieve technology industrialization.

This advanced manufacturing base, built to Industry 4.0 standards, signifies that INNOSHINE Semiconductor, with first-tier industry-level mass production progress, competitive cost control, and leading MOG technology, injects sustained momentum into the development of the entire Micro-LED industry and provides global customers with a fast-track channel from concept to product.

RMB100mn

Total project investment

40000

㎡

factory area

800

platform

Equipped with cutting-edge equipment

3000

㎡/Month

Target production capacity

RMB100mn

Target output value

Vertical Integration “From Chip to Screen”

Based on the strategic pivot of “From Chip to Screen, Vertical Integration,” INNOSHINE Semiconductor has established a unique, self-innovated manufacturing model, breaking the traditional separation of design, fabrication, packaging, and application in the semiconductor industry, and achieving efficient collaboration across the entire value chain.

The Integrated Smart Manufacturing Model Addresses Two Long-Standing Industry Pain Points:

Technical Handoff Loss：

Distortion and efficiency loss in technology transfer caused by traditional segmented production

Market Response Lag：

Long cycles from market demand feedback to product adjustment

By accelerating vertical integration from “Chip–Module–Terminal,” INNOSHINE Semiconductor not only optimizes each manufacturing stage but also reconstructs the connection logic between stages, creating a world-class semiconductor display manufacturing system that is highly responsive, quality-controllable, and cost-optimized.

Four Core Capabilities

Full-Chain
Manufacturing Capability End-to-End Process
Autonomy and Control Data-Driven
Production System Flexible and
Agile Manufacturing

Covering complete manufacturing processes from third-generation semiconductor substrates, epitaxy, Micro-LED chips, micro-assembly, to display modules, ensuring end-to-end control over final display performance and fundamentally eliminating interface losses and uncertainties from multi-factory collaboration.

In key processes and equipment domains, INNOSHINE Semiconductor adheres to a strategy combining independent R&D with deep collaboration. Not only mastering core process technologies, but continuously optimizing production processes through process innovation to ensure technical security and supply chain stability.

Building an intelligent production environment with real-time perception and autonomous decision-making. From production scheduling to quality control, from equipment maintenance to energy management, the intelligent system significantly improves production efficiency and product consistency.

Faced with diversified customer demands, production lines are highly modular and reconfigurable. The same intelligent production line can rapidly switch between products of different specifications and technical routes, supporting a “mass customization” business model.

Full-Stack Technology Accumulation Builds Industry Moat

Equipment Investment

The Hard Foundation of Precision Manufacturing

Building an advanced equipment cluster covering lithography, thin-film deposition, etching, packaging, and testing, with equipment strategy focused on three dimensions:

Precision Assurance：

Meeting ultra-high precision requirements for micron-scale chip processes

Efficiency Improvement：

Balancing high throughput with minimal downtime through automated and modular equipment design

Data-Driven：

Highly digitized production equipment provides real-time and accurate data sources for intelligent manufacturing systems

From Efficiency Bottlenecks to Value Creation

INNOSHINE Semiconductor Smart Manufacturing System
Directly Addressing the Three Core Challenges of Third-Generation Semiconductor Industrialization

Overcoming the “Innovation Valley of Death”

INNOSHINE Semiconductor’s vertical integration model seamlessly connects R&D with manufacturing. Leveraging the pilot and mass production capabilities of its Tianjin Super Factory, it significantly reduces the risks and costs associated with new technology industrialization.

Restructuring Cost Architecture

Through full-chain optimization, intelligent management, and large-scale production, costs across all stages are systematically lowered, enabling high-performance Micro-LED products to enter broader application fields.

Accelerating Market Response

The flexible manufacturing system and digital management platform allow rapid adjustment of production strategies, completing the end-to-end process from customer demand to product delivery within weeks, shortening the cycle by over 50% compared with the industry average.