Pioneering the Global Micro-LED Market
IDM
Vertically Integrated Design and Manufacturing
Full-Chain Integrated Smart Manufacturing
(From Chip to Package to Module)
IDM
Vertically Integrated Design and Manufacturing
Smart Manufacturing Scale
6-Inch Glass Substrate
225% More Efficient than 4-Inch
Smart Manufacturing Scale
R&D Advantages
INNOSHINE Semiconductor Possessing
Leading Technology from Micro-LED Chips to Intelligent Displays
R&D Advantages
Patent Portfolio
INNOSHINE Semiconductor In Micro-LED
Materials, Chips, Packaging and Module Fields, Owning Over 100+ Patents
Patent Portfolio
MOG Technology
(Micro-LED on Glass)
Originating from a Disruptive Revolution in Chip Base Materials
World’s First Glass-Based Pixel-Level Integrated Packaging Technology
Core Objective
Addressing the Industry Pain Points of Low Yield, High Cost, and High Technical Complexity in Mass Production of Micro-LEDs;
Accelerating the Commercialization of Micro-LED Across Various Ultra-High-Definition Display Applications.
Process innovation
Material Innovation
Structural Innovation
Advanced Integrated Packaging Technology
High Integration Optical Performance Excellent Heat Dissipation Effective Cost Reduction High Reliability Customizable
High Integration
Precisely Integrated Components
Significantly Improving Space Utilization
Optical Performance
Transparent Imaging Colors
Outstanding Visual Presentation
Excellent Heat Dissipation
High-Efficiency Thermal Design
Ensuring Stable Chip Operation
Effective Cost Reduction
Simplified Process Improves Yield and
Compresses Overall Production Cost
High Reliability
Robust and Durable Structure
Stable Operation under Harsh Environments
Customizable
Flexible Allocation on Demand
Adaptable to Various Application Scenarios
Product Center
China's New Hub for Micro-LED
Smart Manufacturing
INNOSHINE Semiconductor Tianjin Super Smart Manufacturing Factory
Leveraging its Tianjin Super Smart Manufacturing Factory, INNOSHINE Semiconductor vertically integrates R&D and market operations. With industry-leading mass production progress, the lowest costs, and cutting-edge MOG technology, the company rapidly develops new products based on customer needs, responds swiftly to market demand, injects powerful momentum into industry development, and leads third-generation semiconductor products to new heights.
+
10
RMB100mn
Total project investment
20
RMB100mn
Target output value
800
platform
Equipped with cutting-edge equipment
40000
factory area