The Ideal and Reality Difficulties of Micro-LED
Throughout the history of human information interaction, display technology has always played a vital role. From the bulky beginnings of CRT displays in the last century, to the widespread adoption of flat-panel LCD displays, and then to the brilliant emergence of OLED self-emissive technology, each generational leap in display technology has profoundly reshaped the way we perceive the world, engage in production, and conduct social activities. The pursuit of the ultimate visual experience has never ceased.
CRT Displays
Bulky Beginnings
Visible
LCD Displays
Flat-Panel Adoption
Clear
OLED Self-Emissive Displays
Brilliant Evolution
True-to-Life
Micro-LED
The Ultimate Display Technology
Everywhere
You Look
Four Major Challenges on the Path to Micro-LED Commercialization
1
The Yield and Efficiency
Challenge of Mass Transfer
Transferring Millions of Chips
(Accuracy < 99%)
Results in Increased Defects in 4K Displays
2
The Physical Bottleneck of
Ultra-High Resolution
Inherent Limitations of Conventional Substrate Materials in
Thermal Expansion, Contraction, and Flatness Control
3
The Commercialization Barrier
Caused by High Costs
Micro-LED Remains Limited to
a Niche Ultra-Premium Market
Unable to Reach Mainstream Consumers
4
Concerns Over Product Lifespan Due to
Long-Term Reliability
Mismatch in Thermal Expansion Coefficients
Between Chips and Substrates
Causing Stress, Heat Dissipation, and Related Issues
Move Beyond Incremental Fixes，Embrace Transformational Innovation
This Is Not an Incremental Improvement
It Is a Full-Scale Revolution Across Materials, Manufacturing Processes, and System Architecture.
World’s First Glass-Based Pixel-Level
Integrated Packaging Technology
Micro-LED on Glass
MOG (Micro-LED on Glass) technology directly integrates Micro-LED chips onto a
glass substrate through a three-step advanced manufacturing process：
Core Objective
Addressing the industry pain points of low yield, high cost, and high technical complexity in Micro-LED mass production
Accelerating the commercialization of Micro-LED across a wide range of ultra-high-definition display applications
Schematic diagram of chip disassembly
MOGTechnology Features
Revolutionary
Glass Substrate
More Than Transparency
A Foundation for System Stability
Wafer-Level
Manufacturing Process
Exponential Improvement in Yield
±1 μm Pixel-Level Absolute Precision
Pixel-Level
Integrated Packaging
A Revolution in Visual Experience
RGB Three-in-One Eutectic Packaging
Standardized
MOG Devices
Simplifying Complexity
Unlocking Efficient Mass Production
MOGTechnology Breakthrough
MOG Achieves Uniform Full-Color-Gamut Color Mixing
Completely Eliminates Large-Viewing-Angle Color Shift Caused by the Inability of Single-Chip Solutions to Mix Colors Effectively
Full Color Gamut
Uniform Color Mixing
MOG devices extend the emission angle up to
175°
INNOSHINE Semiconductor MOG pixel-integrated chips use ultra-flat, high-transmittance glass substrates combined with advanced optical design to achieve full mixing of RGB light. This innovation eliminates the large-viewing-angle color deviations commonly seen in Mini-LED COB solutions, resulting in highly consistent color across the entire display. MOG devices extend the emission angle to 175° while maintaining consistent light color.
The Smaller
The More Powerful
Micro-LED chips reduce the area compared with Mini-LED chips by
4.23×
INNOSHINE Semiconductor MOG devices integrate RGB pixels onto glass substrates. By applying ultra-precision semiconductor technology on ultra-flat glass, the main chip size is reduced to below 50 μm. The entire MOG pixel package is also extremely compact—only 300×300 or 200×200 μm—ideal for constructing ultra-high-definition modules with pixel pitches between 0.3 mm and 1.2 mm.
Ultimate Pure Black
Immersive Impact
Micro-LED Has Higher Black Area Ratio Than Mini-LED
76.35%
INNOSHINE Semiconductor MOG pixel-integrated chips, through disruptive technological breakthroughs, redefine image depth and impact. The pixel-integrated chip occupies only 0.4% of the pixel area, 6.25× smaller than traditional COB technology. This extreme spatial compression increases the black area ratio of the chips, injecting unprecedented layering into the image and taking screen contrast to a new peak.
More Composed
More Reliable
MOG Chip PAD Size Increased
95.8%
Through a unique fan-out electrode design, the electrode contact area is increased by over 50×. This breakthrough design enables full testing of MOG chips, significantly increasing mass transfer yield of MOG devices to 99.999%, with a first-pass yield of 70%. At the same time, the wavelength consistency of chips within the module reaches an excellent level, controlled within ±1.5 nm.
With Glass-Based“MOG+”
as the Core
“MOG+Scenario”
Redefining the Boundaries of Visual Experience
Professional Display Solutions
Commercial Display Solutions
Home Entertainment Solutions
Cultural and Arts Solutions
Smart Education Solutions
Emerging Display Solutions
“MOG+Product”
Driving Value Upgrades Across the Entire Industry Chain
Partnering with Upstream and Downstream Stakeholders to Build an Open, Collaborative, and Efficient New Micro-LED Industry Ecosystem
MOG+New type of substrate
After the miniaturization of MOG chips, the flatness and heat dissipation of the substrate need to be synchronously improved, and there is a strong demand for collaborative innovation of new types of boards such as glass substrates.
MOG+Driver IC
Collaborating with partners to develop a new generation of driver IC solutions has achieved a low-cost and high-efficiency "lamp driver integration" solution.
MOG+Control algorithm
Develop new applications such as color management, graphics processing, and AI applications based on the characteristics of MOG display screens, combining software and hardware to maximize hardware potential
“MOG+Ecology”
Building a collaborative and evolving industrial community
Co building Micro-LED ecosystem
Win win industry "chip" future
Faced with technological breakthroughs and market explosion opportunities in the Micro-LED industry, Yuanxu Semiconductor takes the IDM integrated intelligent manufacturing model as its core, actively collaborates with upstream and downstream partners, and builds a technologically advanced and resilient Micro-LED industry ecosystem. Only by deeply integrating the industrial chain can we accelerate technological innovation, reduce cost barriers, and vigorously promote the large-scale commercialization of Micro-LED technology.
