Process Inspection Technology-元旭半导体科技股份有限公司

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Process Inspection Technology

At the LED Display Module Inspection Stage
One Fundamental Challenge Has Always Existed

How can we ensure that modules composed of millions—or even hundreds of millions—of micron-scale chips achieve absolute reliability and
exceptional performance consistency? Hidden defects that cannot be
eliminated through conventional sampling inspection, batch-to-batch drift in optoelectronic parameters,
and long-term performance degradation are the root causes of dead pixels, color patches, and failures that appear during the display’s lifecycle, seriously impacting end-brand reputation.

Five-Layer Inspection System

Building a Zero-Defect Quality Control Closed Loop

INNOSHINE Semiconductor directly addresses the industry's core challenges through its self-developed end-to-end process inspection technology. We do more than inspect products—we define the standards of reliability. Through a closed-loop quality system covering “Chip–Package–Module,” we transform uncontrollable risks into manageable data, fundamentally ensuring the ultimate stability and long-term quality of every module shipped from the factory.

Three-Tier Defect Inspection

Layer-by-Layer Screening from Chip to Module

At the wafer and chip stages, two rounds of high-precision AOI visual inspection enable megapixel-level defect detection, intercepting microscopic defects at an early stage; after packaging is completed, full-pixel-array scanning is performed to ensure that every chip meets stringent quality standards before integration. Triple Filtering, Leaving No Place for Defects to Hide.

High precision AOI visual inspection

Pixel level defect recognition

Full pixel array scanning

Optoelectronic Performance Testing

Data-Driven Precision Sorting

INNOSHINE Semiconductor performs 100% inspection and profiling for every selected LED device, generating an independent optoelectronic performance report to ensure performance consistency.

The data is not only used for sorting optimization but also provides a scientific basis for subsequent module matching, fundamentally improving display uniformity.

Consistent Optoelectronic Performance

Complete Parameter Profiling

Scientific Module Matching

85/85 Testing

Reliability Validation Under Extreme Conditions

Long-term stability testing is conducted under harsh conditions of 85°C temperature and 85% humidity, simulating high-temperature and high-humidity operating environments to ensure that chips and packaging structures maintain reliable performance under extreme conditions, extending product lifespan in outdoor and complex environments.

85/85 Environmental Testing

Ensuring Product Reliability

Aging Test

Performance Degradation Control Through Time-Based Simulation

Through continuous power-on and cyclic load aging tests, long-term operating conditions in real-world applications are simulated. Potential early-life failures are proactively identified and eliminated, ensuring that every shipped module has already passed the test of time, with stable and reliable performance characteristics.

Aging Test

Eliminate Risks

Stable Performance

Comprehensive Module Evaluation

System-Level Performance Validation

After module integration is completed, multidimensional testing is conducted on overall optoelectronic performance, color consistency, grayscale response, splicing performance, and other key parameters, ensuring that every shipped unit not only excels individually but also delivers outstanding performance in system-level integration.

More Than Inspection
It Is a Commitment to Quality

Full-Process Control

Quality control extends throughout the entire chain of chips, packaging, and modules, rather than being limited to final inspection.

Data Traceability

From individual chips to complete modules, critical data is recorded throughout the process, supporting quality traceability and analysis.

Standards Beyond Industry Norms

Comprehensive inspection methods exceeding industry standards are implemented, including 100% inspection, full-pixel scanning, and extreme-environment testing.

Empowering Smart Manufacturing for Customers

Detailed device data packages are provided to help customers achieve superior display design and optimization.